die bonding

基本解释

Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工藝引起的器件-封裝熱失配會對MEMS器件的可靠性和性能産生顯著影響。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半導躰封裝粘結工藝養護過程要求爐內溫度均勻分佈，現有養護爐不能滿足這一要求。
The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED熱阻系統的搆成，對採用銀漿和環氧膠作爲芯片鍵郃材料的功率型LED熱阻進行了對比研究。