thermosonic
基本解释
- 热超声
英汉例句
- The dynamic optimum design of high-frequency ultrasonic transducer was studied to improve thermosonic packaging efficiency and reduce packaging temperature.
为提高热超声封装效率、降低封装温度,研究了高频超声换能器的动力学优化设计。 - The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface.
采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。 - Schwizer, J., et al., 1999, ”Thermosonic ball bonding: Friction model based on integrated microsensor measurements,” Electronics Manufacturing Technology Symposium, 24th IEEE / CPMT, pp.108-114.
陈津佑，2000，电子构装热超音波焊线制程之介面能量理论模式的建立及其应用，国立中正大学机械工程研究所，硕士论文。 - Thermosonic Flip Chip Bongding for Power LED Chips
功率型LED芯片的热超声倒装技术 - Formation of circle band interface of thermosonic flip chip bonding
热超声倒装键合环状界面的形成