electrodeposit

基本解释

Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层。
The experimental results show that the corrosion resistance of ZnCr coating is better than that of Zinc electrodeposit.
试验表明，锌铬膜的耐蚀性大大超过镀锌层。
The effect of dipping temperature, time, agitation and base material on adhesion of nickel electrodeposit were studied.
研究了浸渍温度、时间、搅拌和铝合金材料对镀层结合力的影响。
The internal stress of electrodeposit is one of the important factors of affecting electroplatingQuality.
电镀层内应力是影响电镀层质量的重要因素之一。
Abstract: The article discusses the dimension control mechanism of ultra - fine copper powder in the preparation of electrodeposit.
文章摘要: 本文探讨了电沉积过程中超细铜粉的粒径控制机制。