wirebond

常见例句

Better manufacturing yield than wirebond for high pin-count chips.
对于高密度引脚芯片，成品率优于丝键合。
Faster manufacturing through-put than wirebond for high pin-count chips.
对于高密度引脚芯片，生产效率高于丝键合。
In this paper, the main purpose of the analysis is to evaluates the effect of wirebond configuration and die geometry under plane and lateral force.
摘要本文利用有限元素法及梁的挠度理论探讨金线在两种不同的受力情形下，三种不同金线几何形状和晶片位置。