ENIG

常见例句

Electroless nickel under immersion gold (ENIG) provides a solderable coating, but is expensive.
浸金下无电镀镍(ENIG)涂层可以提高可焊性,但此方法比较昂贵。
Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production.
已投产无铅工艺有电金、沉金、沉锡、沉银、有机保护膜及无铅喷锡。
Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production by 2006.
2006年已投产无铅工艺有电金;沉金;沉锡;沉银;有机保护膜及无铅喷锡.
The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.
Niruna沉镍金流程程序相应于一般沉镍金流程;经调整后可被改用于此流程.
Volume manufacturing company can HASL, ENIG Shen, antioxidant (OSP), Shen tin, etc. in line with the ROHS directive single double-sided circuit boards.
公司可批量制造喷锡、沉镍金、抗氧化（OSP）、沉锡等各类符合ROHS指令的单双面电路板。
The high activity of TSF-6850 improves wetting of Lead Free alloys difficult to solder to substrate finishes including OSP-Cu, ENIG and Immersion finishes.
具有高活性的TSF-6850能够提高难于焊接到衬底终饰上的无铅合金(其中包括OSP-Cu、ENIG和浸渍终饰)的湿化特性。